Production Testing of RF and System-on-a-chip Devices for Wireless Communications

Front Cover
Artech House, 2004 - Technology & Engineering - 249 pages
With the increasing number of integrated wireless devices being developed with SOC (system on a chip) technology, a merger of RF and mixed-signal test approaches is quickly becoming a necessity. Addressing this need head-on, this first-of-its-kind resource offers you an in-depth overview of RF and SOC product testing for wireless communications. The book introduces new, creative methods that lead to more efficient testing, such as multi-site and parallel testing. You learn how to determine critical measurements for specific applications, including Bluetooth, WLAN, and 3G devices. Moreover, the book shows you how to perform these measurements cost effectively in a production test environment.
 

Selected pages

Contents

An Introduction to Production Testing
1
13 The Test Program
2
16 Automated Test Equipment
3
172 Load Boards
5
174 Production RF and SOC Wafer Probing
6
18 Calibration
9
19 The Test Floor and Test Cell
10
112 Design for Testing
11
5203 Initial Carrier Frequency Tolerance
118
5204 Carrier Frequency Drift
119
5205 VCO Drift
120
521 Receiver Tests
124
5211 Bit Error Rate
125
5212 Bit Error Rate Methods
127
5214 Field Programmable Gate Array Method
128
5216 BER Measurement with a Digitizer
130

References
12
RF and SOC Devices
13
22 RF Low Noise Amplifier
15
24 RF Mixer
16
25 RF Switch
19
26 Variable Gain Amplifier
20
27 Modulator
22
28 Demodulator
23
29 Transmitter
24
211 Transceiver
25
212 Wireless Radio Architectures
26
215 Phase Locked Loop
28
216 RF and SOC Device Tests
30
References
31
Cost of Test
33
33 Early Testing of the SOC
36
34 SCM and IDM
37
36 Key CostofTest Modeling Parameters
38
361 Fixed Cost
39
363 Lifetime
40
365 Yield
41
366 Accuracy as It Relates to Yield
42
37 Other Factors Influencing COT
45
372 Test Engineer Skill
46
Production Testing of RF Devices
49
43 Transmission Line Theory Versus LumpedElement Analysis
50
44 The History of Power Measurements
51
45 The Importance of Power
52
46 Power Measurement Units and Definitions
53
48 Power Expressed in dBm
54
410 Average Power
55
411 Pulse Power
56
413 RMS Power
57
414 Gain
58
4141 Gain Measurements of Wireless SOC Devices
60
415 Gain Flatness
61
4151 Measuring Cain Flatness
63
4152 Automatic Cain Control Flatness
65
416 PowerAdded Efficiency
67
417 Transfer Function for RF Devices
68
418 Power Compression
69
419 Mixer Conversion Compression
72
4201 Harmonic Distortion
73
4202 Intermodulation Distortion
75
4203 Receiver Architecture Considerations for Intermodulation Products
79
4212 Measuring ACPR
81
422 Filter Testing
82
423 SParameters
84
4233 SParameters of a TwoPort Device
85
4234 Scalar Measurements Related to SParameters
86
4235 SParameters Versus Transfer Function
88
4236 How to Realize SParameter Measurements
89
4238 Characteristics of a Coupler
90
424 Summary
91
References
92
VSWR Return Loss and Reflection Coefficient
93
Production Testing of SOC Devices
95
52 SOC Integration Levels
96
53 Origins of Bluetooth
97
54 Introduction to Bluetooth
98
55 Frequency Hopping
99
56 Bluetooth Modulation
100
58 Adaptive Power Control
102
510 Phase Locked Loop
103
511 Divider
104
515 Synthesizer Settling Time
105
516 Testing Synthesizer Settling Time in Production
106
518 Differential Phase Versus Time
110
519 Digital Control of an SOC
112
520 Transmitter Tests
113
5201 Transmit Output Spectrum
114
5202 Modulation Characteristics
117
522 BER Receiver Measurements
132
5222 Carriertointerference BER Tests
133
5225 Inband and OutofBand Blocking BER Tests
135
5227 Maximum Input Power Level BER Test
137
5232 Definition of Error Vector Magnitude
138
5233 Making the Measurement
139
5234 Related Signal Quality Measurements
141
5235 Comparison of EVM with More Traditional Methods of Testing
142
References
143
Fundamentals of Analog and MixedSignal Testing
145
621 DC Offsets and PeaktoPeak Input Voltages
146
63 The Fourier Transform and the FFT
147
633 The Discrete Fourier Transform
149
634 The Fast Fourier Transform
150
642 Convolution
151
643 Frequency and TimeDomain Transformations
152
65 Nyquist Sampling Theory
154
66 Dynamic Measurements
156
662 SNR for AWCs and Digitizers
159
663 SINAD and Harm Distortion
160
67 Static Measurements
163
672 INLDNL for AWGs and Digitizers
164
68 Real Signals and Their Representations
165
682 Transformation Formulas
166
Similarities and Differences
167
6101 Phase Noise and How It Relates to RF Systems
168
6112 Amplitude and Phase Balance Using Complex FFTs
169
612 ZIP Receivers and DC Offsets
171
613 Summary
172
References
173
Moving Beyond Production Testing
175
74 Parallel Testing of RF SOC Devices
178
75 True Parallel RF Testing
179
76 Pseudoparallel RF Testing
180
77 Alternative Parallel RF Testing Methods
182
78 Guidelines for Choosing an RF Testing Method
184
79 Interleaving Technique
185
710 DSP Threading
186
711 True Parallel RF Testing CostofTest Advantages and Disadvantages
187
712 Pseudoparallel RF Testing CostofTest Advantages and Disadvantages
188
713 Introduction to Concurrent Testing
189
714 Design for Test
190
715 Summary
191
References
192
Production Noise Measurements
193
812 Types of Noise
194
813 Noise Floor
198
82 Noise Figure
199
822 Noise Power Density
201
823 Noise Sources
202
825 Excess Noise Ratio
203
826 YFactor
204
828 Measuring Noise Figure
205
829 NoiseFigure Measurements on Frequency Translating Devices
209
8210 Calculating Error in NoiseFigure Measurements
210
8211 Equipment Error
211
8213 ProductionTest Fixturing
212
83 Phase Noise
213
832 PhaseNoise Definition
214
833 Spectral DensityBased Definition of Phase Noise
216
835 Thermal Effects on Phase Noise
217
839 Making PhaseNoise Measurements
218
8310 Measuring Phase Noise with a Spectrum Analyzer
220
8312 Phase Noise of FastSwitching RF Signal Sources
222
Power and Voltage Conversions
225
RF Coaxial Connectors
229
List of Acronyms and Abbreviations
233
List of Numerical Prefixes
237
About the Authors
239
Index
241
Copyright

Other editions - View all

Production Testing of RF and System-on-a-chip Devices for Wireless ...
Keith B. Schaub,Joe Kelly
No preview available - 2004

Common terms and phrases

adjacent channel Agilent Technologies amplifier amplitude analog bandwidth baseband BER test bits block diagram Bluetooth carrier CDMA chip complex components compression connectors cost of test decibels demodulator desired signal distortion downconverted engineers error error vector magnitude example filter Fourier transform FPGA frequency domain function handler harmonic impedance input power integrated intermodulation ISM band load board manufacturer method Microwave mixed-signal mixer modulated multiple noise figure noise floor noise power noise source output power parallel testing parameters performed phase detector phase noise phase-noise measurement power level power measurements probe probe card production testing production-test quency radio ratio receiver RF and SOC RF devices RF testing S-parameters samples shown in Figure SINAD specific spectrum switches synthesizer settling term test equipment test setup test system tester third-order throughput time-domain tion transmitted vector versus voltage VSWR wafer waveform wireless SOC devices Y-factor

Bibliographic information

TitleProduction Testing of RF and System-on-a-chip Devices for Wireless Communications
Artech House microwave library
AuthorsKeith B. Schaub, Joe Kelly
PublisherArtech House, 2004
ISBN1580538487, 9781580538480
Length249 pages
Subjects › 

Technology & Engineering / Electrical
Technology & Engineering / Mobile & Wireless Communications
Technology & Engineering / Radio
Technology & Engineering / Telecommunications
  
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