Wire Bonding in MicroelectronicsThe Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES:
|
Contents
| 1 | |
| 13 | |
3 Bonding Wire Metallurgy and Characteristics That Can Affect Bonding Reliability or Testing | 51 |
4 Wire Bond Testing | 79 |
5 GoldAluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding | 131 |
6 Introduction to Plating Section A Gold and Section B NickelBased Bond Pad Technology and Reliability | 183 |
7 Cleaning to Improve Bondability and Reliability | 225 |
8 Mechanical Problems in Wire Bonding | 249 |
9 Advanced and Specialized Wire Bonding Technologies | 293 |
10 An Overview of the Materials and Material Science of Copper Lowk Devices that Affect Bonding and Packaging | 349 |
11 Wire Bonding Process Modeling and Simulation | 365 |
Glossary | 407 |
Bibliography | 413 |
Index | 415 |
Other editions - View all
Common terms and phrases
activation energy Aluminum annealed Au-Al autobonders ball bond bond interface bond pad bondability bonder bonding force bonding machine bonding tool bonding wire bumps capillary Chap CHMT contamination Copper corrosion crack cratering Cu/Lo-k cycling damage deformation devices dielectric diffusion effect electroless Electronic Components elongation epoxy FIGURE fine-pitch flip chips frequency Gold Wire Hybrid IEEE IEEE Trans IMAPS increase interconnections intermetallic compounds Kirkendall voids layer Lo-k loop height material metal metallurgical method Microelectronics modulus Ni/Pd/Au normal oxide package pad structure pitch plasma plasma cleaning plating polyimide polymer probe problems Proc pull force pull test reliability result second bond semiconductor shear force shear strength shear test shown in Fig silicon strength substrate surface Technology temperature thermal Thermocompression thermosonic thick films thin tion typical ultrasonic energy ultrasonic welding UV-ozone wafer wedge bonds welded wire bonding wire bonding process yield µm diameter