High Temperature Electronics
CRC Press, Dec 13, 1996 - Technology & Engineering - 352 pages
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.
Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.
High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.
Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
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Overview of High Temperature Electronics
Selection and Use of Silicon Devices at High
Wide Bandgap Semiconductors
Passive Device Selection and Use at High Temperature
Firstlevel Packaging Considerations for the Use of Electronic Hardware
Second and Third Level Packaging Considerations for the Use of Electronic
Thermal Management for High Temperature Electronics
Accelerated Testing of Elevated Temperature
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actuator adhesive aircraft alloys aluminum ambient applications As-deposited bandgap barrier height breakdown voltage capacitance capacitors carrier ceramic coefficient of thermal components conductor connector contact resistance converter cooling copper corrosion crystals decrease density devices dewar die attach dielectric constant diodes dissipation factor doping ECAs electrical electromigration elevated temperatures engine environment epoxy Equation eutectic fabricated failure film fixture flux function of temperature GaAs gate glass glass transition temperature growth heat sink high-temperature electronics higher increased insulation integrated circuits interconnect interface intermetallic junction temperature layer leakage current limited materials maximum mechanical melting metal modulus MOSFET n-type nickel ohmic contacts operating temperature oxide passive Pecht performance plating polyimide polymer properties reduced reliability resistors room temperature seal semiconductor shown in Figure silicon sintering solder strength stress substrate surface switching techniques temperature electronics temperature range thermal conductivity thermal expansion transistor tungsten typical wafer wire