Wafer Bonding: Applications and TechnologyMarin Alexe, Ulrich Gösele During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. |
Contents
| 13 | |
11 | 28 |
13 | 34 |
15 | 42 |
18 | 49 |
SilicononInsulator by the Smart Cut Process | 85 |
Maleville | 104 |
and Porous Silicon | 106 |
5 | 185 |
of Electronic Devices | 193 |
ThreeDimensional Photonic Bandgap Crystals | 315 |
Wafer Direct Bonding for HighBrightness LightEmitting Diodes | 327 |
HighDensity Hybrid Integration of IIIV Compound Optoelectronics | 359 |
Layer Transfer by Bonding and Laser LiftOff | 377 |
SingleCrystal Lithium Niobate Films by Crystal Ion Slicing 417 | 416 |
Wafer Bonding of Ferroelectric Materials | 451 |
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Common terms and phrases
achieved alignment annealing anodic Appl Phys Lett applications bipolar bonded wafer bonding interface boron bulk buried oxide circuits cleanroom cm² CMOS crack density deposition device layers dielectric dielectric isolation diodes direct bonding doping electrical Electrochem Soc ELTRAN epitaxial growth epitaxial layer etching fabrication ferroelectric flip-chip fusion bonding GaAs gate Gösele handle wafer heterostructure hydrogen IEEE III-V implantation insulator integration interconnects ion implantation lattice layer transfer light-emitting diodes LiNbO3 manufacturing material mechanical metal method micrograph MOSFET nitride ohmic contact optical Patent photonic crystal polishing polyimide polySi porosity porous silicon layer Proc region sapphire second porous seed wafer Semiconductor wafer bonding shown in Fig shows SICOI SiGe silicide silicon channel silicon dioxide silicon substrate silicon-on-insulator single-crystal SiO2 Smart Cut splitting stack strained silicon stress structure substrate technique temperature thermal thickness thin film transistor trench VCSEL vertical voltage water jet