Dynamic Techno-management Capability: The Case of Samsung Semiconductor Sector in KoreaBased on a case study which focuses on the dynamics of technological development of Samsung's semiconductors, this work investigates the role of Management of Technology in achieving firms' competitiveness. Samsung has recently emerged as one of the world's leaders in the DRAM area. The dynamic capability of managing technology includes resource-exploiting, management-integrating, and path-navigating activities. The integration of those activities is vital for managing chaos, trials and errors, and balance between the retrospective and the proactive in the course of technology development. The essence of this study is to recognise the built-in characteristics fo the firm as innovation sources, rather than external conditions. |
Contents
Theoretical background | 9 |
Research design | 41 |
Technology development paths of Samsung | 79 |
Copyright | |
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1M DRAM 64K DRAM accumulated addition ASIC assembly basic billion Bucheon plant Byung-Chull Lee cent chaebol CMOS competitive consortium core decision development team domestic DRAM area DRAM products DTMC EEPROM engineers equipment and raw evolutionary example firm capability firm unit level firm's focused foreign firms Goldstar huge in-house innovation studies interview investment Japanese firms Korean firms Korean semiconductor industry leading firms mainly major management of technology managerial practices manpower mass production memory area Micron Technology mobilization operation organizational outpost company overall path dependency performance planning private firms proactive decision problems process technology product development production line production plant production process production technologies recruited research institutes resource-based view role sales volume Samsung Group semiconductor area semiconductor division semiconductor sector sources SRAM strategic management strong task force team technical technological ability technological capability technology development activities technology development paths technology imports VLSI level wafer fabrication