High Temperature ElectronicsThe development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly. |
Contents
Passive Device Selection and Use at High Temperature | 3-47 |
Firstlevel Packaging Considerations for the Use of Electronic Hardware at High | 4-16 |
Second and Third Level Packaging Considerations for the Use of Electronic Hardware | 5-30 |
Thermal Management for High Temperature Electronics | 6-32 |
Applications | 6-48 |
Other editions - View all
High Temperature Electronics F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski Limited preview - 1996 |
High Temperature Electronics F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski Limited preview - 2018 |
High Temperature Electronics F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski No preview available - 2019 |
Common terms and phrases
accelerated testing actuator adhesive aircraft alloys aluminum ambient applications bandgap barrier height breakdown voltage capacitance capacitors carrier ceramic characteristics coefficient of thermal components conductor connector contact resistance converter cooling copper corrosion decrease density devices dewar die attach diodes dissipation factor doping ECAs electrical electromigration electronic systems elevated temperatures engine environment epoxy eutectic fabricated failure film fixture flux function of temperature GaAs gate glass glass transition temperature gold heat sink high-temperature electronics higher increased insulation integrated circuits interconnect interface intermetallic junction temperature layer leakage current limited materials maximum mechanical metal module MOSFET n-type nickel ohmic contacts operating temperature oxide passive Pecht performance plating polyimide polymer properties reduced reliability resistors room temperature Schottky barrier seal semiconductor shown in Figure Silicon Carbide sintering solder strength stress substrate surface switching techniques temperature electronics temperature range thermal conductivity thermal expansion transistors tungsten typical wafer wire